by Mat Dirjish

SK Hynix, supplier of dynamic random access memory (DRAM) chips, flash memory chips (NAND flash), and CMOS image sensors (CIS), is set to showcase its energy-efficient, high-performance memory devices at CES 2023. Debuting under the theme of Green Digital Solutions, the devices are part of the company’s Carbon-Free Future campaign.

The core device at the show, the PS1010 E3.S, is an eSSD chip consisting of multiple 176-layer 4D NAND that supports fifth generation PCIe interfaces. According to the company, the PS1010 exhibits reading and writing speeds that are 130% and 49% faster, respectively, than the previous generation. SK Hynix also claims its performance-per-watt is also better by more than 75%, thereby reducing server operation costs and carbon emissions.

Other devices debuting at CES include the HBM3, a memory device boasting the world’s best specification for high performance computing, GDDR6-AiM that adopts PIM technology, and CXL memory capable of flexible expansion of memory capacity.

Finally, SK hynix will introduce SK enmove immersion cooling technology that cools heat-producing servers by submerging them into cooling oil. As a result, total energy consumption is 30% less than air-cooling technologies.

Ready to learn more? If so, pay a visit to the SK Hynix website.

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