by Mat Dirjish

EV Group, a provider of process solutions for semiconductor designs and chip integration schemes, announces a major upgrade to its EVG120 automated resist processing system. The next-gen system adds in-situ resist thickness metrology, wafer edge exposure, and EVG150-level performance in a smaller format.

The next-generation EVG 120 automated resist processing system from EV Group provides significantly higher throughput, greater flexibility, and improved process control compared to the previous generation, all in an ultra-compact platform. Source: EV Group

As per the company, its updated EVG120 delivers significantly higher throughput, greater flexibility, and improved process control compared to the previous generation. It is viable for packaging, MEMS, image sensors, photonics, power devices, wafer probe cards, and supports spin coating, spray coating, and developing photoresist materials in photolithography applications.

The system also accommodates a wide range of substrate types and sizes from 2 in. up to 200 mm and supports a variety of resist materials. These include thin, thick, positive tone, and negative tone, dielectrics like PI and PBO, as well as black/color/IR resists for specialty applications.

Summarily, the EVG120 is a compact 200-mm platform that integrates up to two wet processing modules and 14 bake/chill plates, translating into a 40% increase in capacity over the previous generation. The system’s footprint is smaller by more than 20%, while design improvements reportedly enable easier access for tool maintenance and modular configuration. Added capabilities include:

• Wafer Edge Exposure (WEE): enables selective edge exposure for better edge accuracy and uniformity.
• In-situ Resist Thickness Measurement: enables real-time process monitoring for higher yield and process control. Measurement range is from 50 nm to 50 µm.
• Enhanced High-Viscosity Dispense System: high-pressure dispensing with closed-loop feedback provides precision coating performance on thick photoresists.
• Support for SMIF Loadports: enables cleaner and more efficient material handling.
• Stand-by Mode: reduces energy consumption during idle periods; supports SEMI E167 compliance.

Dr. Thomas Glinsner, corporate technology director at EV Group, said, “With new capabilities such as in-situ metrology and wafer edge exposure, as well as features inherited from our EVG150 platform, the EVG120 delivers an unmatched combination of coating and developing performance, throughput, flexibility and cost of ownership in a compact, production-ready platform.” For deeper insights, peruse the EVG 120 specs and overview.

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