by Mat Dirjish
Micro- and nano-technologies research institute CEA-Leti and CEA-List, a specialist in smart digital systems, are collaborating with Powerchip Semiconductor Manufacturing Corp. (PSMC) to introduce……… Continue reading Partners Prepare 3D Stacking And Interposer Tech For Next-Gen AI
by Mat Dirjish
Partners CEA-Leti and Fraunhofer IPMS have completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, which they claim is a milestone in establishing a……… Continue reading Collaborators Validate Wafer Exchange for Ferroelectric Memory Materials
by NHanced Semiconductors
At the first Advanced Packaging International Conference (APIC) NHanced Semiconductors president Robert Patti will present a talk entitled……… Continue reading First APIC Will Present A New Paradigm for Semiconductor Manufacturing
Mat Dirjish Online 