by Mat Dirjish
Vishay Intertechnology’s thin-film sub-mount platform supports next-generation optical transceivers, RF modules, and……… Continue reading Thin Film Sub-mount Platform Supports Next-gen Electronic Packaging Applications
by Mat Dirjish
Micro- and nano-technologies research institute CEA-Leti and CEA-List, a specialist in smart digital systems, are collaborating with Powerchip Semiconductor Manufacturing Corp. (PSMC) to introduce……… Continue reading Partners Prepare 3D Stacking And Interposer Tech For Next-Gen AI
by Mat Dirjish
Partners CEA-Leti and Fraunhofer IPMS have completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, which they claim is a milestone in establishing a……… Continue reading Collaborators Validate Wafer Exchange for Ferroelectric Memory Materials
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