by Mat Dirjish
Provider of connectivity components Molex claims its Impress Co-Packaged Copper Solutions address the requirements of next-generation data centers and AI workflows by supporting ultra-high-speed data transmissions while ensuring signal integrity. The Impress components provide a compression-based, substrate connector and mating cable assembly that supports data rates up to 224 Gbps PAM-4 and higher.
Impress Co-Packaged Copper places the connection point directly onto the ASIC package substrate. A two-piece connector system, it shrinks the distance signals must travel through the printed circuit board. The result is a tuned, full-channel component with complete isolation from the substrate to the interconnect, thereby reducing signal loss and crosstalk.
Impress Co-Packaged Copper Solutions from Molex deliver near-ASIC, on-substrate connectivity designed to support 224Gbps PAM‑4 and beyond for next-generation AI and hyperscale data centers.
The Impress socket attaches to the substrate via compression to prevent damage to the substrate layer and simplify rework, maintenance, and upgrades. Additionally, it features an over-molded cable strain relief and a mechanical contact wipe to reinforce long-term mating durability and operational lifecycles.
Jairo Guerrero, VP & GM, Copper Solutions, Molex, explains, “As AI workloads push data centers to their physical limits, we focus on maximizing efficiency without sacrificing signal integrity. Impress is our latest innovation to help scale infrastructures without exponential increases in power consumption or cost. By enabling high performance at the rack level, Molex is making next-generation compute more technically and economically viable.”
Molex Impress Co-Packaged Copper Solutions are available now. Development work is underway to validate the components for use with 336G and 448G applications. For deeper details, datasheets, and guides, peruse the Impress Co-Packaged Copper Solutions overview.
Mat Dirjish Online 