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Category: Packaging

Components, IEEE, Packaging, semiconductorsLeave a comment

Partners Cut A Pathway To Fully Monolithic Silicon RF Front-Ends

December 17, 2025December 15, 2025 mdirjish

by Mat Dirjish

At IEDM 2025, CEA-Leti and STMicroelectronics presented key enablers for a new high-performance and versatile RF Si platform that integrates active and passive devices used in……… Continue reading Partners Cut A Pathway To Fully Monolithic Silicon RF Front-Ends

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