by Mat Dirjish
Micro- and nano-technologies research institute CEA-Leti and CEA-List, a specialist in smart digital systems, are collaborating with Powerchip Semiconductor Manufacturing Corp. (PSMC) to introduce……… Continue reading Partners Prepare 3D Stacking And Interposer Tech For Next-Gen AI
by Mat Dirjish
Partners CEA-Leti and Fraunhofer IPMS have completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, which they claim is a milestone in establishing a……… Continue reading Collaborators Validate Wafer Exchange for Ferroelectric Memory Materials
by Mat Dirjish
Developer of miniaturization technologies CEA-Leti and NcodiN, a French startup specializing in nano-laser-enabled photonic interconnects, are collaborating to……… Continue reading Partners Ready To Industrialize 300-mm Silicon Photonics For AI Interconnects
Mat Dirjish Online 