by Mat Dirjish
Vishay Intertechnology’s SGCM05339 space-grade, surface-mount common mode choke provides EMI filtering and noise suppression in space, aerospace, and defense applications.
The component is particularly suitable for……… Continue reading Space-Grade Common Mode Choke Tackles GaN And SiC Switching Apps
by Mat Dirjish
Developer of miniaturization technologies CEA-Leti and NcodiN, a French startup specializing in nano-laser-enabled photonic interconnects, are collaborating to……… Continue reading Partners Ready To Industrialize 300-mm Silicon Photonics For AI Interconnects
by NHanced Semiconductors
At the first Advanced Packaging International Conference (APIC) NHanced Semiconductors president Robert Patti will present a talk entitled……… Continue reading First APIC Will Present A New Paradigm for Semiconductor Manufacturing
by IEEE
The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida. The premier international event for semiconductor packaging, components, and microelectronic systems, ECTC 2026 will feature……… Continue reading 2026 ECTC Features Keynote From Advanced Semiconductor Engineering
by Mat Dirjish
Validated for Qualcomm Technologies’ Snapdragon Wear Elite Platform, Bosch Sensortec’s ultra-low power, high-performance BMP585 barometric pressure sensor is……… Continue reading High-Performance Pressure Sensor Enters Elite Next-Gen Wearables Platform
by Mat Dirjish
Addressing the accuracy and energy efficiency demands of industrial applications, Vishay Intertechnology’s VOx619A series phototransistor optocouplers combine a high and linear current transfer ratio (CTR) over temperature with a forward current……… Continue reading Phototransistor Optocouplers Meet Industrial Accuracy And Efficiency Requirements
by Mat Dirjish
Provider of connectivity components Molex claims its Impress Co-Packaged Copper Solutions address the requirements of next-generation data centers and AI workflows by supporting……… Continue reading Co-Packaged Copper Components Meet Next-Gen Data Center And AI Workflow Challenges
by Mat Dirjish
Vishay Intertechnology’s AEC-Q200 qualified RCA-SR e3 series thick-film technology (TFT) chip resistors combine solid sulfur resistance with long term stability. Available in……… Continue reading TFT Chip Resistors Feature Proven Sulfur Resistance And Long-Term Stability
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