2026 IMAPS Symposium Addresses Ultra-Fine Pitch Hybrid Bonding Technology
by Mat Dirjish
At the 2026 IMAPS Symposium, NHanced Semiconductors Vice President Dr. Charles Woychik, a team lead by Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida, and semiconductor equipment supplier Besi, will present a paper titled……… Continue reading 2026 IMAPS Symposium Addresses Ultra-Fine Pitch Hybrid Bonding Technology

