by Mat Dirjish
At the 2026 IMAPS Symposium, NHanced Semiconductors Vice President Dr. Charles Woychik, a team lead by Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida, and semiconductor equipment supplier Besi, will present a paper titled “Technical Challenges for Ultra Fine Pitch Hybrid Bonding.” The paper will describe the key technical barriers to implementing ultra-fine pitch hybrid bonding, as well as the emerging process solutions and equipment innovations that will enable the transition to the ultra-high-density interconnects required for AI and high-performance computing applications.
Left: Dr. Charles Woychik, VP of Business Development. Right: Dr. Navid Asadizanjani, Associate Professor at the University of Florida
Hybrid bonding is a foundational technology for next-generation packaging of semiconductor devices. Applications in AI, memory architectures, photonics, and quantum computing require higher interconnect densities and shorter signal paths than traditional packaging approaches provide. Hybrid bonding addresses increasing demands for higher performance, lower power, and increased functionality by combining direct copper-to-copper connections at extremely fine pitches, enabling near-monolithic integration of chiplets, dies, wafers, and substrates.
Scaling hybrid bonding processes to ultra-fine pitches presents a range of technical challenges in materials, process integration, equipment capabilities, and reliability concerns. These challenges become more complex as the industry transitions to heterogeneous integration in systems where logic, memory, photonics, and RF devices using dissimilar process technologies and materials. The paper will describe these key challenges and the process innovations necessary to surmount them, including alignment accuracy, surface preparation, and thermal considerations.
Running from September 28 to October 8 at the Encore Boston Harbor Hotel in Boston, MA, the 2026 IMAPS Symposium’s theme is “Intelligent Packaging for the AI Era; Heterogeneous Integration and Photonics.” Also on tap is a comprehensive program for microelectronics and advanced packaging content. In addition to the technical program, the IMAPS Symposium includes an exhibition hall, professional development courses, keynote presentations, panel discussions, and networking receptions.
For more details, visit the 2026 IMAPS Symposium website. Also visit the NHanced Semiconductors, Quantum Computing Inc., and Florida Semiconductor Institute (FSI) websites.
Mat Dirjish Online 