by Mat Dirjish

Vishay Intertechnology’s thin-film sub-mount platform supports next-generation optical transceivers, RF modules, and electronic packaging applications requiring high thermal performance, precision alignment, and high frequency signal integrity. The company employs precision deposition of passive circuit elements and precision machining of ceramic substrates, including aluminum nitride (AlN). Reportedly, this approach delivers reliable thermal conductivity, dimensional stability, and better electrical performance in demanding environments.

The platform targets high speed data communications including 800G, 1.6T, and 3.2T optical transceivers where increasing power densities and tighter packaging constraints require greater heat dissipation. Platform features and benefits include:

• Quick-turn prototyping with high volume production capability from three manufacturing locations.
• High thermal conductivity: AlN-based substrates support efficient heat dissipation for high power devices.
• High frequency performance: low loss thin film interconnects support microwave and millimeter-wave applications.
• Miniaturization: compact, integrated designs support space-constrained modules.
• Reduction in manufacturing complexity: pre-deposited AuSn or EPIG and precision machining support difficult manufacturing processes.
• Design flexibility: tailored geometries, metallization schemes, and circuit integration support custom designs.

Target applications include:

• Laser diode mounting.
• RF and microwave modules.
• Optical alignment.
• Combined wire bond and SMT processes.
• Hermetic packaging solutions.

Vishay can provide samples and support custom designs now, supported by global production capabilities. For deeper details, peruse the product overview.

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